We have established a joint support system with our affiliated gilding manufacture, Mitomo Semicon Engineering Co., to perform higher - precision coating. This system enables us to provide total service, from the manufacturing of plating solution to every coating process.
Plating machine for connector and lead frames are produced in accordance which are designed to meet demand for high-mix, low-volume production and partial precise plating. Our concept is to produce moduled equipment which is "easy to use", "easy to change production" and "easy to maintain". We offer tailor made products for each customer. We are a world pioneer in plating machine for semiconductor-wafers. We have sold more than 100 units to the worldwide market. We offer plating machine meeting customers' needs.
[ Main Product Line - Plating Machine ]
R/R connector plating machine, Silver spot plating machine for lead frames,
Silver spot plating machine for cut-strip lead frames, Plating machine semiconductor-wafer
